STM32WB10CC Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32 MHz with 320 Kbytes of Flash memory, Bluetooth LE 5.2

Description

The STM32WB10CC multiprotocol wireless and ultra-low-power device embeds a powerful and ultra-low-power radio compliant with the Bluetooth^® Low Energy SIG specification 5.3. It contains a dedicated Arm^® Cortex^®-M0+ for performing all the real-time low layer operation. The device is designed to be extremely low-power and is based on the high-performance Arm^® Cortex^®-M4 32-bit RISC core operating at a frequency of up to 64 MHz. This core features a Floating point unit (FPU) single precision that supports all Arm^®single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) that enhances application security.
Enhanced inter-processor communication is provided by the IPCC with six bidirectional channels. The HSEM provides hardware semaphores used to share common resources between the two processors.
The device embeds high-speed memories (320 Kbytes of flash memory, 48 Kbytes of SRAM) and an extensive range of enhanced I/Os and peripherals.
Direct data transfer between memory and peripherals and from memory to memory is supported by seven DMA channels with a full flexible channel mapping by the DMAMUX peripheral.
The device features several mechanisms for embedded flash memory and SRAM: readout protection, write protection and proprietary code readout protection. Portions of the memory can be secured for Cortex^® -M0+ exclusive access.
The AES encryption engine, PKA and RNG enable upper layer cryptography.
The device offers a fast 12-bit ADC.
The device embeds a low-power RTC, one advanced 16-bit timer, one general-purpose32-bit timer, and two 16-bit low-power timers.
In addition, up to three capacitive sensing channels are available.
The STM32WB10CC also features standard and advanced communication interfaces, namely one USART (ISO 7816, IrDA, Modbus and Smartcard mode), one I2C (SMBus/PMBus), one SPI up to 32 MHz.
The STM32WB10CC operates in the -10 to +85 °C (+105 °C junction) temperature range from a 2.0 to 3.6 V power supply. A comprehensive set of power-saving modes enables the design of low-power applications.
The device includes independent power supplies for analog input for ADC.
A V_BAT dedicated supply allows the device to back up the LSE 32.768 kHz oscillator, the RTC and the backup registers, thus enabling the STM32WB10CC to supply these functions even if the main V_DD is not present through a CR2032-like battery, a Supercap or a small rechargeable battery.
The STM32WB10CC is available in a 48-pin UFQFPN package.

• All features

  • Include ST state-of-the-art patented technology
  • Radio
    • 2.4 GHz
    • RF transceiver supporting Bluetooth^® 5.3 specification
    • RX sensitivity: -95.5 dBm (Bluetooth^® Low Energy at 1 Mbps)
    • Programmable output power up to +4 dBm with 1 dB steps
    • Integrated balun to reduce BOM
    • Support for 1 Mbps
    • Dedicated Arm^® 32-bit Cortex^® M0+ CPU for real-time Radio layer
    • Accurate RSSI to enable power control
    • Suitable for systems requiring compliance with radio frequency regulations ETSI EN 300 328, EN 300 440, FCC CFR47 Part 15 and ARIB STD-T66
    • Support for external PA
    • Available integrated passive device (IPD) companion chip for optimized matching solution (MLPF-WB-01E3)
  • Ultra-low-power platform
    • 2.0 to 3.6 V power supply
    • – 10 °C to +85 °C temperature range
    • 18 nA shutdown mode
    • 700 nA Standby mode + RTC + 48 KB RAM
    • Radio: Rx 7.7 mA / Tx at 0 dBm 8.6 mA
  • Core: Arm^® 32-bit Cortex^®-M4 CPU with FPU, adaptive real-time accelerator (ART™ Accelerator) allowing 0-wait-state execution from flash memory, frequency up to 64 MHz, MPU, 80 DMIPS and DSP instructions
  • Performance benchmark
    • 1.25 DMIPS/MHz (Drystone 2.1)
    • 223.03 CoreMark^® (3.48 CoreMark/MHz at 64 MHz)
  • Energy benckmark
    • 318 ULPMark™ CP score
  • Supply and reset management
    • Ultra-safe, low-power BOR (brownout reset) with five selectable thresholds
    • Ultra-low-power POR/PDR
    • Programmable voltage detector (PVD)
    • V_BAT mode with RTC and backup registers
  • Clock sources
    • 32 MHz crystal oscillator with integrated trimming capacitors (Radio and CPU clock)
    • 32 kHz crystal oscillator for RTC (LSE)
    • Internal low-power 32 kHz RC (LSI1)
    • Internal low-drift 32 kHz (stability ±500 ppm) RC (LSI2)
    • Internal multispeed 100 kHz to 48 MHz oscillator, factory-trimmed
    • High speed internal 16 MHz factory trimmed RC (±1%)
    • 1x PLL for system clock and ADC
  • Memories
    • 320 KB flash memory with sector protection (PCROP) against R/W operations, enabling radio stack and application
    • 48 KB SRAM, including 36 KB with hardware parity check
    • 20x 32-bit backup register
    • Boot loader supporting USART, SPI, I2C interfaces
    • 1 Kbyte (128 double words) OTP
    • OTA (over the air) Bluetooth^® Low Energy
  • Rich analog peripherals (down to 2.0 V)
    • 12-bit ADC 2.5 Msps, 190 µA/Msps
  • System peripherals
    • Inter processor communication controller (IPCC) for communication with Bluetooth^® Low Energy
    • HW semaphores for resources sharing between CPUs
    • 1x DMA controller (7x channels) supporting ADC, SPI, I2C, USART, AES, timers
    • 1x USART (ISO 7816, IrDA, SPI Master, Modbus and Smartcard mode)
    • 1x SPI 32 Mbit/s
    • 1x I2C (SMBus/PMBus^®)
    • Touch sensing controller, up to eight sensors
    • 1x 16-bit, four channels advanced timer
    • 1x 32-bit, four channels timer
    • 2x 16-bit ultra-low-power timer
    • 1x independent Systick
    • 1x independent watchdog
    • 1x window watchdog
  • Security and ID
    • Secure firmware installation (SFI) for Bluetooth^® Low Energy SW stack
    • 2x hardware encryption AES maximum 256-bit for the application and the Bluetooth^® Low Energy
    • HW public key authority (PKA)
    • Cryptographic algorithms: RSA, Diffie-Helman, ECC over GF(p)
    • True random number generator (RNG)
    • Sector protection against R/W operation (PCROP)
    • CRC calculation unit
    • Die information: 96-bit unique ID
    • IEEE 64-bit unique ID, possibility to derive Bluetooth^® Low Energy 48-bit EUI
  • Up to 30 fast I/Os, 28 of them 5 V-tolerant
  • Development support
    • Serial wire debug (SWD), JTAG for the application processor
    • Application cross trigger
  • Package is ECOPACK2 compliant

Product Technical Specifications