Qualcomm® RB3 Gen 2 Lite Development Kit

  • Mã sản phẩm: RB3 Gen 2 Lite Core Kit
  • Nhà sản xuất: Qualcomm
  • Website hỗ trợ: https://www.proe.vn
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Qualcomm® RB3 Gen 2 Lite Development Kit (Core Kit)


Package List:• Development board based on the Qualcomm QCS5430 processor
• 12V wall power supply
• USB Type-C cable
• Micro USB cable
• Mini speakers
• Setup guide
• Pick tool for setting switches
Qualcomm® RB3 Gen 2 Lite Development Kit (Vision Kit)


Package List:• Qualcomm® RB3 Gen 2 Lite Development Kit (Core Kit)
• Mounting bracket for CSI cameras
• High-resolution CSI camera
• Low-resolution CSI camera

Qualcomm® RB3 Gen 2 Lite Development Kit

IoT development kit designed for high-performance compute, accessibility, and flexible and customizable features

The Qualcomm RB3 Gen 2 Lite Development Kit gives developers a valuable combination of impressive performance and customizable features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases such as Robotics, industrial, and automation.

The Qualcomm RB3 Gen 2 Lite is based on the Qualcomm® QCM5430/QCS5430 processor. This processor’s scalable performance is designed to deliver superior features and performance across all dimensions of IoT, specifically for Robotics, Industrial Handhelds (IHH), Retail, Cameras, and Drone applications. This includes support for Wi-Fi for ubiquitous coverage, a unified software stack, powerful AI, and expanded interfaces across ecosystems.

QCM/QCS5430 Specifications

Feature Pack 1 Feature Pack 2 Feature Pack 2.5 Feature Pack 3
Chipset QCx5430 FP1
(Default Config)
QCx5430 FP2
(Mid)
QCx5430 FP2.5
(Mid-High)*
QCx5430 FP3
(High)*
CPU 2 x A78@2.1GHz,
4 x A55@1.8GHz
1 x A78@2.2 GHz,
3 x A78@2.13 GHz
4 x A55@1.8 GHz
1 x A78@2.4 GHz,
3 x A78@2.38 GHz
4 x A55@1.8 GHz
GPU Qualcomm® Adreno™ 642L GPU @ 315 MHz Adreno 642L GPU @ 550 MHz
Support for OpenGL ES 3.2, OpenCL 2.0,Vulkan 1.x, DX FL 12
Modem Sub6+mmW: Him BP 4.3.x Rel 15
Memory (RAM) uMCP package (6 GB LPDDR4x)
Storage (onboard) uMCP package (128 GB UFS Flash)
Process Node/Technology 6nm, 12mm x 14 mm; non-PoP
Memory/Storage Dual-channel, non-PoP LPDDR 5 / LPDDR 4X SDRAM, UFS 2.x/3.1, two-lane HS gear 4, SD v3.0, eMMC 5.1
Compute DSP Hexagon DSP with dual HVX and 2K HMX(~3.5 INT8 TOPS) Clock Speed 1.4 GHz ~6 INT8 TOPS ~9 INT8 TOPS
Connectivity WLAN: Wi-Fi, FM supported Uplink/Downlink MU-MIMO, 4K QAM, 160 MHz channels (5& 6 GHz)
Display Technology Adreno 1075 DPU, On-device Display Resolution: FHD+ (1080 x 2520 pixels) 8L @ 120 fps, 1x DSI D-PHY (4 -lane), DP1.4 SST
Camera ISP Qualcomm Spectra™ 570L ISP, Dual Camera: 2x22 MP 3x22 MP
Video Up to 4K60 decode for H.264/H.265/VP; Up to 4K30 encode for H.264/H.265; Support for HDR10 and HDR10+ playback
Audio Qualcomm® Noise and Echo Cancellation V10, Integrated low-power VA (more keywords, Command First), Audio ML DSP:LPI, Shared 2 MB, 1.4 GHz
Interfaces USB Type-C 3.1, USB 2.0, UFS 2.x/3.1, eMMC 5.1, SD 3.0, 2x PCIe
Security Features Hardware Key Manager & ECC, Secure boot, Crypto Engine, Secure key provisioning, Qualcomm® Trusted Execution Environment, Qualcomm® Content Protection (Widevine, Camera Security Framework, Secure User Interface)
Cellular Modem RF (QCM5430) 400 MHz bandwidth (mmWave), 100 MHz bandwidth (sub-6 GHz)
Location (QCM5430) GPS, GLONASS, NavIC, BeiDou, Galileo, QZSS, and SBAS
Benchmarks LP5: Antutu: ~310K-340K LP5: Antutu: ~350K-400K LP5: Antutu: ~490K
OS Support Android, LU, Windows, Linux
Temp. Range Tj:-30 to 105 C
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